关于计算机的专业术语

关于打字方面

? 1、CPU
3DNow!(3D no waiting,无须等待的3D处理)
AAM(AMD Analyst Meeting,AMD分析家会议)
ABP(Advanced Branch Prediction,高级分支预测)
ACG(Aggressive Clock Gating,主动时钟选择)
AIS(Alternate Instruction Set,交替指令集)
ALAT(advanced load table,高级载入表)
ALU(Arithmetic Logic Unit,算术逻辑单元)
Aluminum(铝)
AGU(Address Generation Units,地址产成单元)
APC(Advanced Power Control,高级能源控制)
APIC(Advanced rogrammable Interrupt Controller,高级可编程中断控制器)
APS(Alternate Phase Shifting,交替相位跳转)
ASB(Advanced System Buffering,高级系统缓冲)
ATC(Advanced Transfer Cache,高级转移缓存)
ATD(Assembly Technology Development,装配技术发展)
BBUL(Bumpless Build-Up Layer,内建非凹凸层)
BGA(Ball Grid Array,球状网阵排列)
BHT(branch prediction table,分支预测表)
Bops(Billion Operations Per Second,10亿操作/秒)
BPU(Branch Processing Unit,分支处理单元)
BP(Brach Pediction,分支预测)
BSP(Boot Strap Processor,启动捆绑处理器)
BTAC(Branch Target Address Calculator,分支目标寻址计算器)
CBGA (Ceramic Ball Grid Array,陶瓷球状网阵排列)
CDIP (Ceramic Dual-In-Line,陶瓷双重直线)
Center Processing Unit Utilization,中央处理器占用率
CFM(cubic feet per minute,立方英尺/秒)
CMT(course-grained multithreading,过程消除多线程)
CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)
CMOV(conditional move instruction,条件移动指令)
CISC(Complex Instruction Set Computing,复杂指令集计算机)
CLK(Clock Cycle,时钟周期)
CMP(on-chip multiprocessor,片内多重处理)
CMS(Code Morphing Software,代码变形软件)
co-CPU(cooperative CPU,协处理器)
COB(Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))
COD(Cache on Die,芯片内核集成缓存)
Copper(铜)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPI(cycles per instruction,周期/指令)
CPLD(Complex Programmable Logic Device,复杂可程式化逻辑元件)
CPU(Center Processing Unit,中央处理器)
CRT(Cooperative Redundant Threads,协同多余线程)
CSP(Chip Scale Package,芯片比例封装)
CXT(Chooper eXTend,增强形K6-2内核,即K6-3)
Data Forwarding(数据前送)
dB(decibel,分贝)
DCLK(Dot Clock,点时钟)
DCT(DRAM Controller,DRAM控制器)
DDT(Dynamic Deferred Transaction,动态延期处理)
Decode(指令解码)
DIB(Dual Independent Bus,双重独立总线)
DMT(Dynamic Multithreading Architecture,动态多线程结构)
DP(Dual Processor,双处理器)
DSM(Dedicated Stack Manager,专门堆栈管理)
DSMT(Dynamic Simultaneous Multithreading,动态同步多线程)
DST(Depleted Substrate Transistor,衰竭型底层晶体管)
DTV(Dual Threshold Voltage,双重极限电压)
DUV(Deep Ultra-Violet,纵深紫外光)
EBGA(Enhanced Ball Grid Array,增强形球状网阵排列)
EBL(electron beam lithography,电子束平版印刷)
EC(Embedded Controller,嵌入式控制器)
EDEC(Early Decode,早期解码)
Embedded Chips(嵌入式)
EPA(edge pin array,边缘针脚阵列)
EPF(Embedded Processor Forum,嵌入式处理器论坛)
EPL(electron projection lithography,电子发射平版印刷)
EPM(Enhanced Power Management,增强形能源管理)
EPIC(explicitly parallel instruction code,并行指令代码)
EUV(Extreme Ultra Violet,紫外光)
EUV(extreme ultraviolet lithography,极端紫外平版印刷)
FADD(Floationg Point Addition,浮点加)
FBGA(Fine-Pitch Ball Grid Array,精细倾斜球状网阵排列)
FBGA(flipchip BGA,轻型芯片BGA)
FC-BGA(Flip-Chip Ball Grid Array,反转芯片球形栅格阵列)
FC-LGA(Flip-Chip Land Grid Array,反转接点栅格阵列)
FC-PGA(Flip-Chip Pin Grid Array,反转芯片针脚栅格阵列)
FDIV(Floationg Point Divide,浮点除)
FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态
FFT(fast Fourier transform,快速热欧姆转换)
FGM(Fine-Grained Multithreading,高级多线程)
FID(FID:Frequency identify,频率鉴别号码)
FIFO(First Input First Output,先入先出队列)
FISC(Fast Instruction Set Computer,快速指令集计算机)
flip-chip(芯片反转)
FLOPs(Floating Point Operations Per Second,浮点操作/秒)
FMT(fine-grained multithreading,纯消除多线程)
FMUL(Floationg Point Multiplication,浮点乘)
FPRs(floating-point registers,浮点寄存器)
FPU(Float Point Unit,浮点运算单元)
FSUB(Floationg Point Subtraction,浮点减)
GFD(Gold finger Device,金手指超频设备)
GHC(Global History Counter,通用历史计数器)
GTL(Gunning Transceiver Logic,射电收发逻辑电路)
GVPP(Generic Visual Perception Processor,常规视觉处理器)
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状网阵封装
HTT(Hyper-Threading Technology,超级线程技术)
Hz(hertz,赫兹,频率单位)
IA(Intel Architecture,英特尔架构)
IAA(Intel Application Accelerator,英特尔应用程序加速器)
ICU(Instruction Control Unit,指令控制单元)
ID(identify,鉴别号码)
IDF(Intel Developer Forum,英特尔开发者论坛)
IEU(Integer Execution Units,整数执行单元)
IHS(Integrated Heat Spreader,完整热量扩展)
ILP(Instruction Level Parallelism,指令级平行运算)
IMM: Intel Mobile Module, 英特尔移动模块
Instructions Cache,指令缓存
Instruction Coloring(指令分类)
IOPs(Integer Operations Per Second,整数操作/秒)
IPC(Instructions Per Clock Cycle,指令/时钟周期)
ISA(instruction set architecture,指令集架构)
ISD(inbuilt speed-throttling device,内藏速度控制设备)
ITC(Instruction Trace Cache,指令追踪缓存)
ITRS(International Technology Roadmap for Semiconductors,国际半导体技术发展蓝图)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(Lightning Data Transport,闪电数据传输总线)
LFU(Legacy Function Unit,传统功能单元)
LGA(land grid array,接点栅格阵列)
LN2(Liquid Nitrogen,液氮)
Local Interconnect(局域互连)
MAC(multiply-accumulate,累积乘法)
mBGA (Micro Ball Grid Array,微型球状网阵排列)
nm(namometer,十亿分之一米/毫微米)
MCA(machine check architecture,机器检查体系)
MCU(Micro-Controller Unit,微控制器单元)
MCT(Memory Controller,内存控制器)
MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)
MF(MicroOps Fusion,微指令合并)
mm(micron metric,微米)
MMX(MultiMedia Extensions,多媒体扩展指令集)
MMU(Multimedia Unit,多媒体单元)
MMU(Memory Management Unit,内存管理单元)
MN(model numbers,型号数字)
MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)
MHz(megahertz,兆赫)
mil(PCB 或晶片布局的长度单位,1 mil = 千分之一英寸)
MIPS(Million Instruction Per Second,百万条指令/秒)
MOESI(Modified, Owned, Exclusive, Shared or Invalid,修改、自有、排除、共享或无效)
MOF(Micro Ops Fusion,微操作熔合)
Mops(Million Operations Per Second,百万次操作/秒)
MP(Multi-Processing,多重处理器架构)
MPF(Micro processor Forum,微处理器论坛)
MPU(Microprocessor Unit,微处理器)
MPS(MultiProcessor Specification,多重处理器规范)
MSRs(Model-Specific Registers,特别模块寄存器)
MSV(Multiprocessor Specification Version,多处理器规范版本)
NAOC(no-account OverClock,无效超频)
NI(Non-Intel,非英特尔)
NOP(no operation,非操作指令)
NRE(Non-Recurring Engineering charge,非重复性工程费用)
OBGA(Organic Ball Grid Arral,有机球状网阵排列)
OCPL(Off Center Parting Line,远离中心部分线队列)
OLGA(Organic Land Grid Array,有机平面网阵包装)
OoO(Out of Order,乱序执行)
OPC(Optical Proximity Correction,光学临近修正)
OPGA(Organic Pin Grid Array,有机塑料针型栅格阵列)
OPN(Ordering Part Number,分类零件号码)
PAT(Performance Acceleration Technology,性能加速技术)
PBGA(Plastic Pin Ball Grid Array,塑胶球状网阵排列)
PDIP (Plastic Dual-In-Line,塑料双重直线)
PDP(Parallel Data Processing,并行数据处理)
PGA(Pin-Grid Array,引脚网格阵列),耗电大
PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)
Post-RISC(加速RISC,或后RISC)
PR(Performance Rate,性能比率)
PIB(Processor In a Box,盒装处理器)
PM(Pseudo-Multithreading,假多线程)
PPGA(Plastic Pin Grid Array,塑胶针状网阵封装)
PQFP(Plastic Quad Flat Package,塑料方块平面封装)
PSN(Processor Serial numbers,处理器序列号)
QFP(Quad Flat Package,方块平面封装)
QSPS(Quick Start Power State,快速启动能源状态)
RAS(Return Address Stack,返回地址堆栈)
RAW(Read after Write,写后读)
REE(Rapid Execution Engine,快速执行引擎)
Register Contention(抢占寄存器)
Register Pressure(寄存器不足)
Register Renaming(寄存器重命名)
Remark(芯片频率重标识)
Resource contention(资源冲突)
Retirement(指令引退)
RISC(Reduced Instruction Set Computing,精简指令集计算机)
ROB(Re-Order Buffer,重排序缓冲区)
RSE(register stack engine,寄存器堆栈引擎)
RTL(Register Transfer Level,暂存器转换层。硬体描述语言的一种描述层次)
SC242(242-contact slot connector,242脚金手指插槽连接器)
SE(Special Embedded,特别嵌入式)
SEC(Single Edge Connector,单边连接器)
SECC(Single Edge Contact Cartridge,单边接触卡盒)
SEPP(Single Edge Processor Package,单边处理器封装)
Shallow-trench isolation(浅槽隔离)
SIMD(Single Instruction Multiple Data,单指令多数据流)
SiO2F(Fluorided Silicon Oxide,二氧氟化硅)
SMI(System Management Interrupt,系统管理中断)
SMM(System Management Mode,系统管理模式)
SMP(Symmetric Multi-Processing,对称式多重处理架构)
SMT(Simultaneous multithreading,同步多线程)
SOI(Silicon-on-insulator,绝缘体硅片)
SOIC (Plastic Small Outline,塑料小型)
SONC(System on a chip,系统集成芯片)
SPGA(Staggered Pin Grid Array、交错式针状网阵封装)
SPEC(System Performance Evaluation Corporation,系统性能评估测试)
SQRT(Square Root Calculations,平方根计算)
SRQ(System Request Queue,系统请求队列)
SSE(Streaming SIMD Extensions,单一指令多数据流扩展)
SFF(Small form Factor,更小外形格局)
SS(Special Sizing,特殊缩放)
SSP(Slipstream processing,滑流处理)
温馨提示:答案为网友推荐,仅供参考
第1个回答  2013-07-04
买本计算机专业中的《文字录入》
第2个回答  2013-07-04
(1)比如“仲”(WKHH)字,光打WKH是不行的,最后要补码,“仲”的最后一笔是“竖”,所以以末笔定区,定在“竖”区,就是HJK这三个键;以字型定位,是指“仲”字属于左右结构的字,所以定位在“H”,而不是“J”(上下结构)。
(2)比如“倩”(WGEG),光打WGE不行,要补码,“倩”的最后一笔是横,定区在DFG三个键上;“倩”是左右结构,所以定位在G。
(3)比如“等”(TFFU),光打TFF不行,要补码,“等”的最后一笔是点,定区在YUI三个键上,“等”是上下结构,所以定位在U。同样“待”字,定区也是在YUI三键上,因为“待”是左右结构,所以定位在Y。
(4)比如“庄”(YFD)字,最后一笔是横,所以定区在DFG三键,但“庄”字是混合结构,所以定位在D。
相似回答